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公开(公告)号：US07795051B2
公开(公告)日：2010-09-14
申请号：US11626280
申请日：2007-01-23
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/56 , H01L33/58 , H01L2224/48465
摘要： An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and area. The submount is soldered atop the heat sink. During solder reflow, the molten solder causes the submount to align with the top mating surface of the heat sink. The LED assembly may further include a substrate having a top mating surface, and the heat sink may further include a bottom mating surface. The top and bottom mating surfaces have substantially the same shape and area. The heat sink is soldered atop the substrate. During solder reflow, the molten solder causes the heat sink to align with the top mating surface of the substrate.
摘要翻译： LED组件包括散热器和底座。 散热器具有可焊接润湿的顶部配合表面，并且底座具有可焊接润湿的底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 底座焊接在散热器顶部。 在焊料回流期间，熔融焊料使得底座与散热器的顶部配合表面对齐。 LED组件还可以包括具有顶部配合表面的衬底，并且散热器还可以包括底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 散热器焊接在基板上。 在焊料回流期间，熔融焊料使得散热器与衬底的顶部配合表面对齐。
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公开(公告)号：US07170151B2
公开(公告)日：2007-01-30
申请号：US10346535
申请日：2003-01-16
IPC分类号： H01L23/495
CPC分类号： H01L33/642 , H01L33/56 , H01L33/58 , H01L2224/48465
摘要： An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and area. The submount is soldered atop the heat sink. During solder reflow, the molten solder causes the submount to align with the top mating surface of the heat sink. The LED assembly may further include a substrate having a top mating surface, and the heat sink may further include a bottom mating surface. The top and bottom mating surfaces have substantially the same shape and area. The heat sink is soldered atop the substrate. During solder reflow, the molten solder causes the heat sink to align with the top mating surface of the substrate.
摘要翻译： LED组件包括散热器和底座。 散热器具有可焊接润湿的顶部配合表面，并且底座具有可焊接润湿的底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 底座焊接在散热器顶部。 在焊料回流期间，熔融焊料使得底座与散热器的顶部配合表面对齐。 LED组件还可以包括具有顶部配合表面的衬底，并且散热器还可以包括底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 散热器焊接在基板上。 在焊料回流期间，熔融焊料使得散热器与衬底的顶部配合表面对齐。
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