发明授权
US07795726B2 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
有权
液冷式电力电子电路，包括直接冷却的半导体芯片的堆叠阵列
- 专利标题： Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
- 专利标题（中）： 液冷式电力电子电路，包括直接冷却的半导体芯片的堆叠阵列
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申请号： US11799925申请日： 2007-05-03
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公开(公告)号： US07795726B2公开(公告)日： 2010-09-14
- 发明人: Bruce A. Myers , Eric A. Brauer
- 申请人： Bruce A. Myers , Eric A. Brauer
- 申请人地址： US MI Troy
- 专利权人： Delphi Technologies, Inc.
- 当前专利权人： Delphi Technologies, Inc.
- 当前专利权人地址： US MI Troy
- 代理商 Jimmy L. Funke
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.
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