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1.发明授权Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips 有权液冷式电力电子电路，包括直接冷却的半导体芯片的堆叠阵列公开(公告)号：US07795726B2
公开(公告)日：2010-09-14
申请号：US11799925
申请日：2007-05-03
申请人： Bruce A. Myers , Eric A. Brauer
发明人： Bruce A. Myers , Eric A. Brauer
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/074 , H01L2225/06555 , H01L2225/06562 , H01L2924/0002 , H01L2924/10158 , H01L2924/00
摘要： A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.
摘要翻译： 限定电力电子电路的通道半导体芯片的堆叠阵列安装在设有用于液体冷却剂的入口和出口通道的密封容器中。 由容器支撑的引线框架端子接合半导体芯片的选定端子，并形成用于将容器安装在具有电和流体互连的电路板上的引线。
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2.发明申请Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips 有权液冷式电力电子电路，包括直接冷却的半导体芯片的堆叠阵列公开(公告)号：US20080272484A1
公开(公告)日：2008-11-06
申请号：US11799925
申请日：2007-05-03
申请人： Bruce A. Myers , Eric A. Brauer
发明人： Bruce A. Myers , Eric A. Brauer
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/074 , H01L2225/06555 , H01L2225/06562 , H01L2924/0002 , H01L2924/10158 , H01L2924/00
摘要： A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.
摘要翻译： 限定电力电子电路的通道半导体芯片的堆叠阵列安装在设有用于液体冷却剂的入口和出口通道的密封容器中。 由容器支撑的引线框架端子接合半导体芯片的选定端子，并形成用于将容器安装在具有电和流体互连的电路板上的引线。
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公开(公告)号：US06822018B2
公开(公告)日：2004-11-23
申请号：US10075978
申请日：2002-02-15
申请人： Arun K. Chaudhuri , Bruce A. Myers
发明人： Arun K. Chaudhuri , Bruce A. Myers
IPC分类号： C08K904
CPC分类号： C08K3/08
摘要： An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.
摘要翻译： 一种具有改进的导热性的电绝缘聚合物基材料，以便适合用作用于从电子设备安装和传导热量的粘合剂。 基于聚合物的材料包括分散在基质材料中的金属颗粒。 金属颗粒被介电涂层包封，使得它们彼此电绝缘。 为了进一步提高聚合物基材料的导热性，基于聚合物的材料还可以包含分散在基体材料和/或电介质涂层中的介电粒子。 该材料也适用于各种电子应用的灌封化合物或封装材料。
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公开(公告)号：US06779260B1
公开(公告)日：2004-08-24
申请号：US10401850
申请日：2003-03-28
IPC分类号： A05K330
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/45124 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01R13/504 , H01R13/665 , H01R43/24 , H05K3/0058 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An overmolded electronic package includes a circuit-carrying substrate and a connector housing or shroud interconnected via a suitable interconnection arrangement. Some embodiments may include a backplate affixed to the substrate and, in some cases, also to the connector housing or shroud. In some embodiments, the connector housing or shroud may be affixed to the substrate, and in any case the entire subassembly of components is overmolded with a rigidly formable molding compound to bond together all components of the subassembly and form the overmolded electronic package. The subassembly of components with the exception of the backplate may alternatively be overmolded with the molding compound, and a backplate thereafter affixed to the subassembly via a compliant bonding medium.
摘要翻译： 包覆成型的电子封装包括电路承载基板和通过适当的互连布置互连的连接器壳体或护罩。 一些实施例可以包括固定到基板的背板，并且在一些情况下还可以包括连接器壳体或护罩。 在一些实施例中，连接器壳体或护罩可以固定到基底上，并且在任何情况下，组件的整个子组件都用可刚性地形成的模制化合物进行包覆模制，以将所述子组件的所有部件结合在一起并形成包覆模制的电子封装。 组件除了背板之外的组件可以替代地用模制复合物包覆成型，然后后板通过柔性粘合介质固定到子组件上。
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公开(公告)号：US5322565A
公开(公告)日：1994-06-21
申请号：US810246
申请日：1991-12-19
申请人： Joseph M. Zachman , Clyde E. Ragan , Steven L. Alexander , Bruce A. Myers , Charles T. Eytcheson
发明人： Joseph M. Zachman , Clyde E. Ragan , Steven L. Alexander , Bruce A. Myers , Charles T. Eytcheson
CPC分类号： H01L21/6715 , H05K3/4053 , H05K2201/09981 , H05K2203/082 , H05K3/1233
摘要： A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.
摘要翻译： 公开了一种能够自动打印在陶瓷基板等的顶表面和底表面之间延伸的通孔的方法和装置。 衬底的周边被放置在支撑件上，支撑件定位衬底的底表面与与衬底的内部部分相互作用的构件间隔开。 相互作用的构件具有与衬底中的通孔相对应的孔，并且其大致垂直于衬底移动到与衬底的底表面并置的位置，并且其孔与位于衬底中的孔对准的位置 基质。 将导电材料施加到衬底的顶表面，并且将真空施加到相互作用构件中的孔以将导电材料拉过衬底中的通孔。 然后中断真空并且相互作用的构件被移回到与衬底的底表面间隔开的位置。
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公开(公告)号：US07352070B2
公开(公告)日：2008-04-01
申请号：US10608702
申请日：2003-06-27
IPC分类号： H01L23/29
CPC分类号： H01L23/295 , H01L21/563 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler having a platelet geometric structure. The platelet structure of the filler allows a desirable coefficient of thermal expansion to be achieved using a very low level of filler material. This low level of filler material facilitates lower viscosity during forming of the encapsulation and/or overmolding, thereby facilitating complete filling of a mold cavity and underfilling of space between a circuit board and a semi-conductor chip electrically connected to the circuit board. In addition, the low viscosity has processing advantages that reduce the potential for damage to electrical components during encapsulation, overmolding and/or underfilling.
摘要翻译： 具有完全包封，包覆成型和/或底部填充的具有均匀且基本上不含梯度的热膨胀系数的改进的包封的，包覆成型的和/或未充满电的电组件包括聚合物基质和具有血小板几何结构的无机填料。 填料的血小板结构允许使用非常低水平的填充材料来实现所需的热膨胀系数。 这种低水平的填充材料在形成封装和/或包覆成型期间有助于较低的粘度，从而有助于模制空腔的完全填充和电路板与电连接到电路板的半导体芯片之间的空间不足。 此外，低粘度具有加工优点，减少在封装，包覆成型和/或底部填充期间损坏电气部件的可能性。
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公开(公告)号：US07334243B2
公开(公告)日：2008-02-19
申请号：US11214634
申请日：2005-08-30
IPC分类号： G11B33/14
CPC分类号： G11B17/028 , G11B17/0282 , G11B33/142
摘要： The present invention relates to the cooling of electronic components such as CD or DVD players and recorders and the disc or discs within. Specifically, the present invention relates to the internal cooling of a disc playing or recording device and the disc or discs within.
摘要翻译： 本发明涉及电子部件如CD或DVD播放器和记录器以及其中的盘或盘的冷却。 具体地说，本发明涉及盘片播放或记录装置的内部冷却以及其内的盘或盘。
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8.发明授权Circuit board with localized stiffener for enhanced circuit component reliability 有权具有局部加强件的电路板，用于增强电路部件的可靠性公开(公告)号：US07094975B2
公开(公告)日：2006-08-22
申请号：US10717839
申请日：2003-11-20
IPC分类号： H05K1/03
CPC分类号： H05K1/0206 , H01L2224/16225 , H01L2224/73204 , H05K1/0271 , H05K3/0061 , H05K2201/068 , H05K2201/10204 , H05K2201/10545 , H05K2201/10674 , H05K2201/2009
摘要： A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.
摘要翻译： 一种电路板组件，包括层压基板和表面安装装置，所述表面安装装置的CTE小于层压基板的CTE，并且与至少一个焊接接头连接到层叠基板的第一表面。 组件还包括附着到层叠基板的第二表面以便与电路装置直接相对的局部加强件。 局部加强件由材料形成并且被成形为使得当附接到层叠基板时，加强件能够增加将该装置附接到基板的一个或多个焊点的热循环疲劳寿命。
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公开(公告)号：US06560110B1
公开(公告)日：2003-05-06
申请号：US10079760
申请日：2002-02-22
IPC分类号： H05K720
CPC分类号： H05K5/064 , H05K7/20463
摘要： A corrosive resistant electronics assembly 10 is provided including at least one heat generating electronics component 12 mounted on a substrate 14 and positioned within potting material 18. A thermally conductive block element 24 is thermally mounted to the at least one heat generating electronics component 12 and positioned within the potting material 18, thereby providing a corrosive resistant electronics assembly 10 with improved thermal dissipation.
摘要翻译： 提供了一种抗腐蚀电子组件10，其包括安装在基板14上并位于灌封材料18内的至少一个发热电子元件12.导热块元件24热安装到至少一个发热电子元件12上并定位 在灌封材料18内，从而提供具有改善的热耗散的耐腐蚀电子组件10。
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10.发明授权
公开(公告)号：US5334422A
公开(公告)日：1994-08-02
申请号：US13851
申请日：1993-02-05
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/498 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/092 , H05K3/22 , H05K3/3452 , Y10T29/49121 , Y10T29/49126
摘要： A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.
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