发明授权
- 专利标题： Flux for soldering, soldering method, and printed circuit board
- 专利标题（中）： 焊接助焊剂，焊接方法和印刷电路板
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申请号： US11727014申请日： 2007-03-23
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公开(公告)号： US07798389B2公开(公告)日： 2010-09-21
- 发明人: Kazuki Ikeda , Hisao Irie , Toshinori Shima , Takaaki Anada , Syunsuke Ishikawa
- 申请人： Kazuki Ikeda , Hisao Irie , Toshinori Shima , Takaaki Anada , Syunsuke Ishikawa
- 申请人地址： JP Hyogo
- 专利权人： Harima Chemicals, Inc.
- 当前专利权人： Harima Chemicals, Inc.
- 当前专利权人地址： JP Hyogo
- 代理机构： Sughrue Mion, PLLC
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; B23K35/36
摘要：
A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.
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