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US07799607B2 Process for forming bumps and solder bump 有权
用于形成凸块和焊料凸块的工艺

Process for forming bumps and solder bump
摘要：
A process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) including solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls, resulting from the grown molten solder powder, are concurrently formed on the electrodes (11) in self-alignment manner. Finally, the flat plate (14) is moved away from the surface of the supplied resin (13), and then the resin (13) is removed to provide a substrate (10) having bumps (16) formed on the plurality of the electrodes.
摘要（中）：

一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该工序中，将具有焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将衬底（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤期间，允许熔融焊料粉末自组装在电极（11）上，使得由生长的熔融焊料粉末产生的多个焊球同时以自对准的方式形成在电极（11）上 方式。 最后，将平板（14）从所提供的树脂（13）的表面移开，然后除去树脂（13），以提供在多个电极上形成有凸点（16）的基板（10） 。

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