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公开(公告)号：US20080017995A1
公开(公告)日：2008-01-24
申请号：US11662286
申请日：2005-09-07
IPC分类号： H01L23/12 , H01L21/603
CPC分类号： H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1152 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/16145 , H01L2224/16238 , H01L2224/29011 , H01L2224/29035 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32052 , H01L2224/32145 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/818 , H01L2224/83102 , H01L2224/83191 , H01L2224/83203 , H01L2224/83886 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/181 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0278 , H05K2203/0425 , Y10S428/901 , Y10T428/24917 , Y10T428/254 , Y10T428/31681 , H01L2924/00 , H01L2224/16225 , H01L2224/32225 , H01L2924/01083 , H01L2924/00012 , H01L2224/05599
摘要： There is provided a flip chip mounting process which is high in productivity and reliability, and thus can be applicable to the flip chip mounting of the next-generation LSI. This flip chip mounting process comprises the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. This heating step is carried out at a temperature higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).
摘要翻译： 提供了一种倒装芯片安装工艺，其生产率和可靠性高，因此可以适用于下一代LSI的倒装芯片安装。 这种倒装芯片安装工艺包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（11）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 该加热步骤在高于对流添加剂（12）的沸点的温度下进行，以允许沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。 最后，树脂被固化，以将半导体芯片（20）固定到布线基板（10）上。
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公开(公告)号：US20070257362A1
公开(公告)日：2007-11-08
申请号：US11661821
申请日：2005-08-30
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81203 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/83855 , H01L2224/83874 , H01L2224/8388 , H01L2224/83886 , H01L2224/92125 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/1579 , H05K3/323 , H05K2201/10977 , H05K2203/0278 , H05K2203/043 , H05K2203/083 , H05K2203/087 , H01L2224/13099 , H01L2924/00 , H01L2924/01083 , H01L2924/00015 , H01L2924/00014
摘要： There is provided a process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) comprising solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls resulting from the grown molten solder powder are concurrently formed on the electrodes (11) in self-alignment manner. Finally, by moving the flat plate (14) away from the surface of the supplied resin (13), followed by removing such resin (13), there is provided the substrate (10) wherein the bumps (16) are formed on the plurality of the electrodes.
摘要翻译： 提供了一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该方法中，将包含焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将衬底（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤中，允许熔融焊料粉末自组装到电极（11）上，从而以自对准的方式在电极（11）上同时形成由生长的熔融焊料粉末产生的多个焊料球。 最后，通过将平板（14）移动远离所提供的树脂（13）的表面，随后除去这种树脂（13），设置有多个基板（10），其中凸块（16）形成在多个 的电极。
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公开(公告)号：US07799607B2
公开(公告)日：2010-09-21
申请号：US11661821
申请日：2005-08-30
IPC分类号： H01L21/44
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81203 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/83855 , H01L2224/83874 , H01L2224/8388 , H01L2224/83886 , H01L2224/92125 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/1579 , H05K3/323 , H05K2201/10977 , H05K2203/0278 , H05K2203/043 , H05K2203/083 , H05K2203/087 , H01L2224/13099 , H01L2924/00 , H01L2924/01083 , H01L2924/00015 , H01L2924/00014
摘要： A process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) including solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls, resulting from the grown molten solder powder, are concurrently formed on the electrodes (11) in self-alignment manner. Finally, the flat plate (14) is moved away from the surface of the supplied resin (13), and then the resin (13) is removed to provide a substrate (10) having bumps (16) formed on the plurality of the electrodes.
摘要翻译： 一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该工序中，将具有焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将衬底（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤期间，允许熔融焊料粉末自组装在电极（11）上，使得由生长的熔融焊料粉末产生的多个焊球同时以自对准的方式形成在电极（11）上 方式。 最后，将平板（14）从所提供的树脂（13）的表面移开，然后除去树脂（13），以提供在多个电极上形成有凸点（16）的基板（10） 。
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公开(公告)号：US08012801B2
公开(公告)日：2011-09-06
申请号：US12717433
申请日：2010-03-04
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1152 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/16145 , H01L2224/16238 , H01L2224/29011 , H01L2224/29035 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32052 , H01L2224/32145 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/818 , H01L2224/83102 , H01L2224/83191 , H01L2224/83203 , H01L2224/83886 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/181 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0278 , H05K2203/0425 , Y10S428/901 , Y10T428/24917 , Y10T428/254 , Y10T428/31681 , H01L2924/00 , H01L2224/16225 , H01L2224/32225 , H01L2924/01083 , H01L2924/00012 , H01L2224/05599
摘要： A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (II), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21).
摘要翻译： 倒装芯片安装工艺包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（II）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 加热步骤在高于对流添加剂（12）的沸点的温度下进行，以允许沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。
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公开(公告)号：US07759162B2
公开(公告)日：2010-07-20
申请号：US11662286
申请日：2005-09-07
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1152 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/16145 , H01L2224/16238 , H01L2224/29011 , H01L2224/29035 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32052 , H01L2224/32145 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/818 , H01L2224/83102 , H01L2224/83191 , H01L2224/83203 , H01L2224/83886 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/181 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0278 , H05K2203/0425 , Y10S428/901 , Y10T428/24917 , Y10T428/254 , Y10T428/31681 , H01L2924/00 , H01L2224/16225 , H01L2224/32225 , H01L2924/01083 , H01L2924/00012 , H01L2224/05599
摘要： A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).
摘要翻译： 倒装芯片安装方法包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（11）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 加热步骤在高于对流添加剂（12）的沸点的温度下进行，以允许沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。 最后，树脂被固化，以将半导体芯片（20）固定到布线基板（10）上。
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公开(公告)号：US20100148376A1
公开(公告)日：2010-06-17
申请号：US12717433
申请日：2010-03-04
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1152 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/16145 , H01L2224/16238 , H01L2224/29011 , H01L2224/29035 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32052 , H01L2224/32145 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/818 , H01L2224/83102 , H01L2224/83191 , H01L2224/83203 , H01L2224/83886 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/181 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0278 , H05K2203/0425 , Y10S428/901 , Y10T428/24917 , Y10T428/254 , Y10T428/31681 , H01L2924/00 , H01L2224/16225 , H01L2224/32225 , H01L2924/01083 , H01L2924/00012 , H01L2224/05599
摘要： A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).
摘要翻译： 倒装芯片安装方法包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（11）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 加热步骤在高于对流添加剂（12）的沸点的温度下进行，以允许沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。 最后，树脂被固化，以将半导体芯片（20）固定到布线基板（10）上。
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7.发明申请FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS 失效浮动芯片安装体，浮动芯片安装方法和浮动芯片安装设备公开(公告)号：US20090008800A1
公开(公告)日：2009-01-08
申请号：US11909856
申请日：2006-03-14
CPC分类号： H01L24/81 , H01L21/563 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/83007 , H01L2224/83097 , H01L2224/83192 , H01L2224/83815 , H01L2224/83874 , H01L2224/8388 , H01L2224/83888 , H01L2224/9201 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/0695 , H01L2224/05599
摘要： The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing the connection terminals (211); and a porous sheet (205) having a box shape that is provided on an opposite side of a formation surface of the electrode terminal (207) of the semiconductor chip (206), is folded on an outer periphery of the semiconductor chip (206) on the formation surface side of the electrode terminal (207) and is in contact with the circuit board (213), wherein the connection terminal (211) of the circuit board (213) and the electrode terminal (207) of the semiconductor chip (206) are connected electrically via a solder layer (215), and the circuit board (213) and the semiconductor chip (206) are fixed by a resin (217). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.
摘要翻译： 本发明的倒装芯片安装体包括：具有多个连接端子（211）的电路板（213）; 具有与所述连接端子相对设置的多个电极端子（207）的半导体芯片（206）。 在所述半导体芯片（206）的外周折叠具有设置在所述半导体芯片（206）的所述电极端子（207）的形成面的相反侧的盒状的多孔片（205） 在电极端子（207）的形成面侧与电路基板（213）接触，电路基板（213）的连接端子（211）和半导体芯片的电极端子（207） 206）通过焊料层（215）电连接，并且电路板（213）和半导体芯片（206）由树脂（217）固定。 因此，提供了将半导体芯片安装在电路板上的优异的生产率和可靠性的倒装芯片安装体以及安装倒装芯片安装体的方法和装置。
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公开(公告)号：US07911064B2
公开(公告)日：2011-03-22
申请号：US11908087
申请日：2006-02-28
申请人： Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
发明人： Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
CPC分类号： H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/81801 , H01L2224/83886 , H01L2225/06517 , H01L2225/06527 , H01L2225/06582 , H01L2225/06593 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要： A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.
摘要翻译： 本发明的安装体包括：层叠半导体芯片10（10a，10b）的多层半导体芯片20， 以及安装基板13，其上安装有多层半导体芯片20。 在该安装体中，多层半导体芯片20中的各半导体芯片10（10a，10b）在与安装基板13相对的芯片面21（21a，21b）上具有多个元件电极12（12a，12b） 在安装基板13上分别形成有与多个元件电极（12a，12b）对应的电极端子14，并且安装基板的电极端子14和元件电极（12a，12b）被连接 通过焊料颗粒的组装形成的焊锡凸块彼此电连接。 利用这种结构，可以容易地制造安装有堆叠的包装的安装体。
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公开(公告)号：US20090230546A1
公开(公告)日：2009-09-17
申请号：US11908087
申请日：2006-02-28
申请人： Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
发明人： Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
IPC分类号： H01L23/498 , B23K31/02
CPC分类号： H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/81801 , H01L2224/83886 , H01L2225/06517 , H01L2225/06527 , H01L2225/06582 , H01L2225/06593 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要： A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.
摘要翻译： 本发明的安装体包括：层叠半导体芯片10（10a，10b）的多层半导体芯片20， 以及安装基板13，其上安装有多层半导体芯片20。 在该安装体中，多层半导体芯片20中的各半导体芯片10（10a，10b）在与安装基板13相对的芯片面21（21a，21b）上具有多个元件电极12（12a，12b） 在安装基板13上分别形成有与多个元件电极（12a，12b）对应的电极端子14，并且安装基板的电极端子14和元件电极（12a，12b）被连接 通过焊料颗粒的组装形成的焊锡凸块彼此电连接。 利用这种结构，可以容易地制造安装有堆叠的包装的安装体。
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公开(公告)号：US20090223705A1
公开(公告)日：2009-09-10
申请号：US11886747
申请日：2006-03-23
申请人： Yoshihisa Yamashita , Seiji Karashima , Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu
发明人： Yoshihisa Yamashita , Seiji Karashima , Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu
CPC分类号： H01L21/6835 , B30B5/02 , B30B15/065 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2221/68354 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75314 , H01L2224/7598 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/83224 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15724 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H05K3/303 , H05K3/305 , H05K3/323 , H05K3/341 , H05K3/3442 , H05K3/3484 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , H01L2924/01083 , H01L2924/00 , H01L2924/00015 , H01L2924/0665 , H01L2224/05599
摘要： An electronic component mounting method includes a step of applying a resin composition (3) including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate (1) provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (7, 8 and 9) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering the group of electronic components to the wiring substrate using the resin by hardening the resin in the resin composition. Accordingly, a mounting process can be remarkably simplified without forming bumps in advance.
摘要翻译： 电子部件安装方法包括以下步骤：将包含焊料粉末，对流添加剂和流动性的树脂组合物（3）在焊料粉末的熔融温度下涂覆在具有导电布线的布线基板（1）的主表面上，以及 连接端子，准备由至少包括无源部件的多个电子部件（7,8,9）组成的一组电子部件的步骤，所述各个电子部件包括电极端子，位置对准连接端子与电极端子 并且使电子部件组与该树脂组合物的表面接触，至少加热该树脂组合物以熔化焊料粉末并通过对流使焊料粉末自组装在连接端子与电极端子之间的步骤 通过焊接连接端子和电极端子，a 通过使树脂组合物中的树脂硬化，使用树脂将电子部件组固定地粘合到布线基板的步骤。 因此，无需预先形成凸块，可以显着地简化安装工艺。
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