发明授权
- 专利标题： Method of coating substrate
- 专利标题（中）： 涂层方法
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申请号： US12153995申请日： 2008-05-28
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公开(公告)号： US07799701B2公开(公告)日： 2010-09-21
- 发明人: Seiji Heike , Tomihiro Hashizume , Masayoshi Ishibashi
- 申请人： Seiji Heike , Tomihiro Hashizume , Masayoshi Ishibashi
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Stites & Harbison, PLLC
- 代理商 Juan Carlos A. Marquez, Esq.
- 优先权： JP2007-141271 20070529
- 主分类号： H01L21/31
- IPC分类号： H01L21/31
摘要：
A method of coating by supplying a liquid material from a nozzle tip to form a film on a substrate surface facing to the nozzle, having the steps of: preparing a translation mechanism, which is capable of moving the nozzle in an in-plane direction and in a thickness direction of the substrate; making the nozzle to come gradually closer to the substrate, after positioning of the nozzle on the in-plane of the substrate, by using the translation mechanism; detecting electric current flowing through the nozzle from the substrate surface, when a semiconductor droplet supplied from the nozzle tip contacts with an electrode installed at the substrate surface; stopping accession of the nozzle to the substrate, when the electric current exceeds threshold value set in advance; and making the nozzle tip apart from the substrate farther than in the stopping, so as to coat the substrate with the liquid material.
公开/授权文献
- US20080299292A1 Method of coating substrate 公开/授权日：2008-12-04
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