Embodiments of the invention provide methods and apparatus for managing temperature in integrated circuits. In accordance with an aspect of the invention, an integrated circuit comprises a monitored region defined by three or more edges. What is more, the integrated circuit comprises at least two temperature sensors for each of the three or more edges. The temperature sensors are arranged along the three or more edges such that each edge has substantially the same arrangement of temperature sensors. Thermal management of the integrated circuit may be accomplished by modifying functional aspects of the integrated circuit in response to measurements provided by the temperature sensors.