发明授权
- 专利标题: Printed board assembly
- 专利标题(中): 印刷电路板组装
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申请号: US11812508申请日: 2007-06-19
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公开(公告)号: US07800915B2公开(公告)日: 2010-09-21
- 发明人: Lars Engblom , Mats Johansson , Peter Scott
- 申请人: Lars Engblom , Mats Johansson , Peter Scott
- 申请人地址: SE Stockholm
- 专利权人: Telefonaktiebolaget LM Ericsson (publ)
- 当前专利权人: Telefonaktiebolaget LM Ericsson (publ)
- 当前专利权人地址: SE Stockholm
- 代理机构: Nixon & Vanderhye P.C.
- 主分类号: H01R12/16
- IPC分类号: H01R12/16
摘要:
The present invention relates to a method and a printed board assembly for use in a MicroTCA system, wherein backplane pin connectors of the printed board assembly are arranged to be received in receiving connectors of a backplane interconnect, characterized in that it comprises at least one switch unit which is arranged with physical output/input ports that have physical port numbers that can be overridden by logical port numbers, an optimal routing of a number of sets of conductive threads in the printed board assembly arranged so that none of the conductive threads cross over each other while connecting physical output/input ports of the switch units with the backplane pin connectors, and printed circuit board layers arranged to shield signals travelling in the conductive threads in conductive layers of the printed circuit board layers from any significant crosstalk.
公开/授权文献
- US20080257594A1 Printed board assembly and a method 公开/授权日:2008-10-23
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