发明授权
US07803504B2 Mask pattern of semiconductor device and manufacturing method thereof 失效
半导体器件的掩模图案及其制造方法

  • 专利标题: Mask pattern of semiconductor device and manufacturing method thereof
  • 专利标题(中): 半导体器件的掩模图案及其制造方法
  • 申请号: US11880395
    申请日: 2007-07-20
  • 公开(公告)号: US07803504B2
    公开(公告)日: 2010-09-28
  • 发明人: Jun Seok Lee
  • 申请人: Jun Seok Lee
  • 申请人地址: KR Seoul
  • 专利权人: Dongbu HiTek Co., Ltd.
  • 当前专利权人: Dongbu HiTek Co., Ltd.
  • 当前专利权人地址: KR Seoul
  • 代理机构: The Law Offices of Andrew D. Fortney
  • 代理商 Andrew D. Fortney
  • 优先权: KR10-2006-0068528 20060721
  • 主分类号: G03F1/00
  • IPC分类号: G03F1/00
Mask pattern of semiconductor device and manufacturing method thereof
摘要:
Provided is a mask pattern of a semiconductor device. The mask pattern includes a plurality of main patterns and a plurality of assistance patterns. The main patterns are adjacent to one another. The assistance pattern is disposed on at least one of an end portion and a middle portion of each of the main patterns and has a line width greater than that of the main pattern. The assistance patterns are staggered.
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