发明授权
- 专利标题: Liquid metal ion gun
- 专利标题(中): 液态金属离子枪
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申请号: US12076481申请日: 2008-03-19
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公开(公告)号: US07804073B2公开(公告)日: 2010-09-28
- 发明人: Hiroyasu Kaga , Yuichi Madokoro , Shigeru Izawa , Tohru Ishitani , Kaoru Umemura
- 申请人: Hiroyasu Kaga , Yuichi Madokoro , Shigeru Izawa , Tohru Ishitani , Kaoru Umemura
- 申请人地址: JP Tokyo
- 专利权人: Hitachi High-Technologies Corporation
- 当前专利权人: Hitachi High-Technologies Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2003-409352 20031208
- 主分类号: H01J49/10
- IPC分类号: H01J49/10 ; H01J27/02
摘要:
An emitter of a Ga liquid metal ion source is constituted to include W12 of a base material and Ga9 of an ion source element covering a surface as construction materials. By making back-sputtered particles become elements (W and Ga) of the Ga liquid metal ion sour source, if back-sputtered particles attach to the Ga liquid metal ion source, contamination which may change physical characteristics of Ga9 does not occur. A W aperture is used as a beam limiting (GUN) aperture to place Ga of approx. 25 mg (of melting point of 30° C.) on a surface of a portion included in a beam emission region (Ga store). When emitting ions to the beam limiting (GUN) aperture, Ga in the emission region melts and diffuses on a surface of the beam emission region of the W aperture.
公开/授权文献
- US20080210883A1 Liquid metal ion gun 公开/授权日:2008-09-04
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