Invention Grant
- Patent Title: Semiconductor component with surface mountable devices and method for producing the same
- Patent Title (中): 具有表面贴装装置的半导体元件及其制造方法
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Application No.: US11748135Application Date: 2007-05-14
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Publication No.: US07804178B2Publication Date: 2010-09-28
- Inventor: Erich Syri , Gerold Gruendler , Juergen Hoegerl , Thomas Killer , Volker Strutz
- Applicant: Erich Syri , Gerold Gruendler , Juergen Hoegerl , Thomas Killer , Volker Strutz
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102006022748 20060512
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L29/40
Abstract:
A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.
Public/Granted literature
- US20070262433A1 Semiconductor Component with Surface Mountable Devices and Method for Producing the Same Public/Granted day:2007-11-15
Information query
IPC分类:
