Invention Grant
- Patent Title: Two-dimension linear platform
- Patent Title (中): 二维线性平台
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Application No.: US12025049Application Date: 2008-02-03
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Publication No.: US07804206B2Publication Date: 2010-09-28
- Inventor: Chi-Pin Chou
- Applicant: Chi-Pin Chou
- Applicant Address: TW Taichung
- Assignee: Hiwin Mikrosystem Corp.
- Current Assignee: Hiwin Mikrosystem Corp.
- Current Assignee Address: TW Taichung
- Agent Banger Shia
- Main IPC: H02K41/00
- IPC: H02K41/00

Abstract:
A two-dimension linear platform comprises a first displacement module and a second displacement module. The first displacement module includes a carrying member, at least one active linear module and at least one passive linear module. The active linear module and the passive linear module of the first displacement are parallel and opposite each other and are both disposed on the carrying member of the first displacement module. The second displacement module includes a carrying member, at least one active linear module and at least one passive linear module. The carrying member of the second displacement module is disposed on the active linear module and the passive linear module of the first displacement module. The active linear module and the passive linear module of the second displacement module are parallel and opposite each other and are disposed on the carrying member of the second displacement module.
Public/Granted literature
- US20090193924A1 Two-Dimension Linear Platform Public/Granted day:2009-08-06
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