Invention Grant
- Patent Title: Semiconductor package and fabricating method thereof
- Patent Title (中): 半导体封装及其制造方法
-
Application No.: US11734999Application Date: 2007-04-13
-
Publication No.: US07808105B1Publication Date: 2010-10-05
- Inventor: Jong Sik Paek
- Applicant: Jong Sik Paek
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Gunnison, McKay & Hodgson, L.L.P.
- Agent Serge J. Hodgson
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/28
Abstract:
A semiconductor package includes a first semiconductor die; a first redistribution layer coupled to a bonding pad of the first semiconductor die; a first solder bump coupled to the first redistribution layer; a second semiconductor die; a second redistribution layer coupled to a bonding pad of the second semiconductor die; a second solder bump coupled to the second redistribution layer and to the first solder bump; a third redistribution layer coupled to the second redistribution layer; and a solder ball coupled to the third redistribution layer.
Information query
IPC分类:
