Invention Grant
- Patent Title: Component assembly and alignment
- Patent Title (中): 组件组装和对齐
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Application No.: US11861559Application Date: 2007-09-26
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Publication No.: US07808259B2Publication Date: 2010-10-05
- Inventor: Benjamin N. Eldridge , Eric D. Hobbs , Gaetan L. Mathieu
- Applicant: Benjamin N. Eldridge , Eric D. Hobbs , Gaetan L. Mathieu
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.
Public/Granted literature
- US20090079452A1 COMPONENT ASSEMBLY AND ALIGNMENT Public/Granted day:2009-03-26
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