Method, apparatus and computer program product for electrical package modeling

Invention Grant

US07809543B2 Method, apparatus and computer program product for electrical package modeling 失效

Title translation: 电气封装建模的方法，设备和计算机程序产品

Patent Title: Method, apparatus and computer program product for electrical package modeling
Patent Title (中): 电气封装建模的方法，设备和计算机程序产品
Application No.: US11621184

Application Date: 2007-01-09
Publication No.: US07809543B2

Publication Date: 2010-10-05
Inventor: Charles Chiu , Craig Lussier
Applicant: Charles Chiu , Craig Lussier
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agency: Roberts Mlotkowski Safran & Cole, P.C.
Agent David Cain
Main IPC: G06F17/50
IPC: G06F17/50 ; G06F9/45

Abstract:

A method, apparatus, and computer program product for creating a model representing an electrical network residing in an integrated circuit package.

Abstract(Chinese):

一种用于创建表示集成电路封装中的电网的模型的方法，装置和计算机程序产品。

Public/Granted literature

Information query

Espacenet