Invention Grant
US07810065B2 System and method for implementing optimized creation of openings for de-gassing in an electronic package
失效
用于实现电子封装中用于去气的开口的优化创建的系统和方法
- Patent Title: System and method for implementing optimized creation of openings for de-gassing in an electronic package
- Patent Title (中): 用于实现电子封装中用于去气的开口的优化创建的系统和方法
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Application No.: US11844861Application Date: 2007-08-24
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Publication No.: US07810065B2Publication Date: 2010-10-05
- Inventor: Gerald K. Bartley , Darryl J. Becker , Paul E. Dahlen , Philip R. Germann , Andrew B. Maki , Mark O. Maxson , Trevor J. Timpane
- Applicant: Gerald K. Bartley , Darryl J. Becker , Paul E. Dahlen , Philip R. Germann , Andrew B. Maki , Mark O. Maxson , Trevor J. Timpane
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Dillon & Yudell LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
System and method for designing an electronic package. A placement manager receives a physical design of an electronic package from a packaging design tool. The placement manager receives design constraints regarding the physical design for the electronic package. The placement manager inserts specifications for at least one de-gassing opening in the physical design for the electronic package, wherein the specification for at least one de-gassing opening are created in accordance with said design constraints regarding said physical design of said electronic package. The placement manager outputs an updated physical design of the electronic package.
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