发明授权
- 专利标题: Tape core wire wiring apparatus
- 专利标题(中): 带芯线接线装置
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申请号: US11423302申请日: 2006-06-09
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公开(公告)号: US07810229B2公开(公告)日: 2010-10-12
- 发明人: Kyoichi Sasaki , Masayoshi Suzuki , Ken Sukegawa
- 申请人: Kyoichi Sasaki , Masayoshi Suzuki , Ken Sukegawa
- 申请人地址: JP Tokyo
- 专利权人: Tomoegawa Paper Co., Ltd.
- 当前专利权人: Tomoegawa Paper Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Wood, Herron & Evans, L.L.P.
- 优先权: JP2005-172605 20050613; JP2005-172606 20050613
- 主分类号: B23P19/00
- IPC分类号: B23P19/00 ; H01R43/00
摘要:
There is provided a tape core wire manufacturing apparatus that makes it possible to manufacture a large variety of tape core wires in small quantities with ease, and in addition, makes it easy to apply a uniform coating over a broad width. In the tape core wire manufacturing apparatus of the present invention, a coating apparatus that applies a coating material to respective optical fiber core wires has a coating head that moves in the longitudinal direction relatively to the respective optical fiber core wires that have been placed in a row on a coating jig. The coating head has a position adjustment surface that is located in the vicinity of a coating member of the coating head and adjusts the positioning in the thickness direction of the respective optical fiber core wires when these are in the form of a tape. This position adjustment surface is pressed against the respective optical fiber core wires. The coating head is also able to be tilted in the longitudinal direction.