Invention Grant
- Patent Title: Sealing member fitting apparatus
- Patent Title (中): 密封件装配装置
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Application No.: US11961055Application Date: 2007-12-20
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Publication No.: US07810230B2Publication Date: 2010-10-12
- Inventor: Yuji Ikeda , Koji Imai , Minoru Abe , Jun Funakawa , Koichi Nakajima , Daisuke Toma , Hirohide Miyazaki
- Applicant: Yuji Ikeda , Koji Imai , Minoru Abe , Jun Funakawa , Koichi Nakajima , Daisuke Toma , Hirohide Miyazaki
- Applicant Address: JP Kanagawa-Ken
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Barley Snyder LLC
- Priority: JP2006-355072 20061228
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
A sealing member fitting apparatus includes a sealing member transfer device that switches between a sealing member receiving position where the sealing member transfer device faces a sealing member holding device provided with a hollow sealing member and a sealing member fitting position where the sealing member transfer device faces an electrical wire clamping device. The sealing member transfer device receives the sealing member in the sealing member receiving position and fits the sealing member on a covering end portion of the electrical wire in the sealing member fitting position. An electrical wire insertion guide device is disposed between the sealing member transfer device and the electrical wire clamping device and is slidable along the electrical wire from a lead-out member to the covering end portion. The sealing member transfer device positions a central axis of the covering end portion substantially coaxially with a central axis of the sealing member.
Public/Granted literature
- US20080155816A1 Sealing Member Fitting Apparatus Public/Granted day:2008-07-03
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