Invention Grant
- Patent Title: Multi-layer capacitor
- Patent Title (中): 多层电容器
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Application No.: US12029702Application Date: 2008-02-12
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Publication No.: US07813105B2Publication Date: 2010-10-12
- Inventor: William S. Cheung
- Applicant: William S. Cheung
- Applicant Address: HK Hong Kong
- Assignee: ADC Tech International Ltd.
- Current Assignee: ADC Tech International Ltd.
- Current Assignee Address: HK Hong Kong
- Agency: Connolly Bove Lodge & Hutz LLP
- Main IPC: H01H4/02
- IPC: H01H4/02

Abstract:
An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
Public/Granted literature
- US20080130197A1 MULTI-LAYER CAPACITOR AND METHOD OF MANUFACTURING SAME Public/Granted day:2008-06-05
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