公开(公告)号：US07813105B2

公开(公告)日：2010-10-12

申请号：US12029702

申请日：2008-02-12

申请人： William S. Cheung

发明人： William S. Cheung

IPC分类号： H01H4/02

CPC分类号： H01G13/00 ,  B32B37/12 ,  B32B2457/16 ,  H01G2/103 ,  H01G4/005 ,  H01G4/02 ,  H01G4/236 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T29/49171 ,  Y10T156/10 ,  Y10T156/16 ,  Y10T156/1702

摘要： An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.

摘要翻译： 公开了一种电子部件及其制造方法。 多个电极以堆叠关系定位以形成电极堆叠。 堆叠可以包括少至两个电极，但是根据所需的子部件的数量，可以使用更多的电极。 相邻电极之间的间距由制造过程中的可移除间隔物确定。 相邻电极之间的所得空间基本上被气体填充，气体物质可以是通过抽空该空间形成的实际气体填充物，空气或减压气体。 此外，相邻的电极结合在一起以保持间隔。 形成套管以封装堆叠，其中第一和第二导电表面保持暴露在壳体外部。 第一导电表面电耦合到第一电极，并且第二导电表面电耦合到第二电极。

公开(公告)号：US20100116417A1

公开(公告)日：2010-05-13

申请号：US12692122

申请日：2010-01-22

申请人： William S. Cheung

发明人： William S. Cheung

IPC分类号： B32B38/10

CPC分类号： H01G13/00 ,  B32B37/12 ,  B32B2457/16 ,  H01G2/103 ,  H01G4/005 ,  H01G4/02 ,  H01G4/236 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T29/49171 ,  Y10T156/10 ,  Y10T156/16 ,  Y10T156/1702

摘要： An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.

摘要翻译： 公开了一种电子部件及其制造方法。 多个电极以堆叠关系定位以形成电极堆叠。 堆叠可以包括少至两个电极，但是根据所需的子部件的数量，可以使用更多的电极。 相邻电极之间的间距由制造过程中的可移除间隔物确定。 相邻电极之间的所得空间基本上被气体填充，气体物质可以是通过抽空该空间形成的实际气体填充物，空气或减压气体。 此外，相邻的电极结合在一起以保持间隔。 形成套管以封装堆叠，其中第一和第二导电表面保持暴露在壳体外部。 第一导电表面电耦合到第一电极，并且第二导电表面电耦合到第二电极。

公开(公告)号：US20080130197A1

公开(公告)日：2008-06-05

申请号：US12029702

申请日：2008-02-12

申请人： William S. Cheung

发明人： William S. Cheung

IPC分类号： H01G4/30 ,  B32B38/00 ,  H01L21/64

CPC分类号： H01G13/00 ,  B32B37/12 ,  B32B2457/16 ,  H01G2/103 ,  H01G4/005 ,  H01G4/02 ,  H01G4/236 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T29/49171 ,  Y10T156/10 ,  Y10T156/16 ,  Y10T156/1702

摘要： An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.

摘要翻译： 公开了一种电子部件及其制造方法。 多个电极以堆叠关系定位以形成电极堆叠。 堆叠可以包括少至两个电极，但是根据所需的子部件的数量，可以使用更多的电极。 相邻电极之间的间距由制造过程中的可移除间隔物确定。 相邻电极之间的所得空间基本上被气体填充，气体物质可以是通过抽空该空间形成的实际气体填充物，空气或减压气体。 此外，相邻的电极结合在一起以保持间隔。 形成套管以封装堆叠，其中第一和第二导电表面保持暴露在壳体外部。 第一导电表面电耦合到第一电极，并且第二导电表面电耦合到第二电极。