Invention Grant
- Patent Title: Component packaging apparatus, systems, and methods
- Patent Title (中): 组件包装设备，系统和方法
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Application No.: US11866795Application Date: 2007-10-03
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Publication No.: US07816171B2Publication Date: 2010-10-19
- Inventor: Paul A. Koning , James C. Matayabas, Jr.
- Applicant: Paul A. Koning , James C. Matayabas, Jr.
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.
Public/Granted literature
- US20080023817A1 COMPONENT PACKAGING APPARATUS, SYSTEMS, AND METHODS Public/Granted day:2008-01-31
Information query
IPC分类:
