发明授权
- 专利标题： Composition of polycyanate ester and biphenyl epoxy resin
- 专利标题（中）： 聚氰酸酯和联苯环氧树脂的组成
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申请号： US10529738申请日： 2003-09-29
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公开(公告)号： US07816430B2公开(公告)日： 2010-10-19
- 发明人: Yasuyuki Mizuno , Daisuke Fujimoto , Hiroshi Shimizu , Kazuhito Kobayashi , Takayuki Sueyoshi
- 申请人： Yasuyuki Mizuno , Daisuke Fujimoto , Hiroshi Shimizu , Kazuhito Kobayashi , Takayuki Sueyoshi
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2002-286878 20020930; JP2002-287071 20020930
- 国际申请： PCT/JP03/12399 WO 20030929
- 国际公布： WO2004/029127 WO 20040408
- 主分类号： C08K5/01
- IPC分类号： C08K5/01 ; C08K5/07 ; C08L63/00 ; C08L101/02
摘要：
The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.
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