发明授权
- 专利标题： Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
- 专利标题（中）： 用于热界面材料和封装的低压缩力，非硅树脂，高导热配方
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申请号： US12357744申请日： 2009-01-22
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公开(公告)号： US07816785B2公开(公告)日： 2010-10-19
- 发明人: Sushumna Iruvanti , Randall G. Kemink , Rajneesh Kumar , Steven P. Ostrander , Prabjit Singh
- 申请人： Sushumna Iruvanti , Randall G. Kemink , Rajneesh Kumar , Steven P. Ostrander , Prabjit Singh
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Joseph Petrokaitis
- 主分类号： H01L23/10
- IPC分类号： H01L23/10
摘要：
An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.