Invention Grant
US07817412B2 Non-peripherals processing control module having improved heat dissipating properties
有权
具有改善的散热特性的非外围设备处理控制模块
- Patent Title: Non-peripherals processing control module having improved heat dissipating properties
- Patent Title (中): 具有改善的散热特性的非外围设备处理控制模块
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Application No.: US11833852Application Date: 2007-08-03
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Publication No.: US07817412B2Publication Date: 2010-10-19
- Inventor: Jason A. Sullivan
- Applicant: Jason A. Sullivan
- Agency: Kirton & McConkie
- Agent David B. Tingey
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.
Public/Granted literature
- US20080013270A1 Non-Peripherals Processing Control Module Having Improved Heat Dissipating Properties Public/Granted day:2008-01-17
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