Invention Grant
US07818878B2 Integrated circuit device mounting with folded substrate and interposer
有权
集成电路器件安装与折叠的基板和插入
- Patent Title: Integrated circuit device mounting with folded substrate and interposer
- Patent Title (中): 集成电路器件安装与折叠的基板和插入
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Application No.: US12042222Application Date: 2008-03-04
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Publication No.: US07818878B2Publication Date: 2010-10-26
- Inventor: Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
- Applicant: Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
- Applicant Address: US CA Santa Clara
- Assignee: INTEL Corporation
- Current Assignee: INTEL Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes & Victor LLP
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
Public/Granted literature
- US20080148559A1 FOLDED SUBSTRATE WITH INTERPOSER PACKAGE FOR INTEGRATED CIRCUIT DEVICES Public/Granted day:2008-06-26
Information query
