发明授权
US07820244B2 Method of forming a layer and method of removing reaction by-products
失效
形成层的方法和除去反应副产物的方法
- 专利标题: Method of forming a layer and method of removing reaction by-products
- 专利标题(中): 形成层的方法和除去反应副产物的方法
-
申请号: US11589716申请日: 2006-10-31
-
公开(公告)号: US07820244B2公开(公告)日: 2010-10-26
- 发明人: Jung-Hun Seo , Jin-Gi Hong , Yun-Ho Choi , Hyun-Chul Kwun , Eun-Taeck Lee , Jin-Ho Kim
- 申请人: Jung-Hun Seo , Jin-Gi Hong , Yun-Ho Choi , Hyun-Chul Kwun , Eun-Taeck Lee , Jin-Ho Kim
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR10-2005-0102949 20051031
- 主分类号: C23C16/00
- IPC分类号: C23C16/00
摘要:
In a method of forming a layer, a titanium layer and a titanium nitride layer may be successively formed on a first wafer. By-products adhered to the inside of a chamber during the formation of the titanium nitride layer may be removed from the chamber. Processes of forming the titanium layer, forming the titanium nitride layer, and removing the by-products may be repeated relative to a second wafer.
公开/授权文献
信息查询
IPC分类: