Invention Grant
- Patent Title: Substrate processing control method and storage medium
- Patent Title (中): 基板处理控制方法和存储介质
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Application No.: US12511749Application Date: 2009-07-29
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Publication No.: US07824931B2Publication Date: 2010-11-02
- Inventor: Susumu Saito , Akitaka Shimizu
- Applicant: Susumu Saito , Akitaka Shimizu
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-196271 20080730
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
In a substrate processing control method, a first process acquires a first-reflectance-spectrum of a beam reflected from the first-fine-structure and a second-reflectance-spectrum of a beam reflected from the second-fine-structure for each of varying-pattern-dimensions of the first-fine-structure when the pattern-dimension of the first-fine-structure is varied. A second process acquires reference-spectrum-data for each of the varying-pattern-dimensions of the first-fine-structure by overlapping the first-reflectance-spectrum with the second-reflectance-spectrum. A third process actually measures beams reflected from the first and the second-fine-structure, respectively, after irradiating light beam on to the substrate and acquiring reflectance-spectrums of the actual-measured beams as actual-measured spectrum data. A fourth process compares the actual-measured spectrum data with the respective reference-spectrum data and acquiring, as the measured pattern-dimension, one of the varying-pattern-dimensions corresponding to reference-spectrum data that is closely matches with the actual-measured spectrum data. A final process ends the processing of the substrate if the measured pattern-dimension reaches a value.
Public/Granted literature
- US20100029020A1 SUBSTRATE PROCESSING CONTROL METHOD AND STORAGE MEDIUM Public/Granted day:2010-02-04
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