Invention Grant
- Patent Title: Filled epoxy compositions
- Patent Title (中): 填充环氧组合物
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Application No.: US11732253Application Date: 2007-04-03
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Publication No.: US07829188B2Publication Date: 2010-11-09
- Inventor: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
- Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Agent Gail D. Tanzer
- Main IPC: B32B27/20
- IPC: B32B27/20 ; B32B27/38 ; C08L63/00 ; C08K3/34 ; C08K3/36
Abstract:
Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.
Public/Granted literature
- US20070232727A1 Filled epoxy compositions Public/Granted day:2007-10-04
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