发明授权
- 专利标题: Semiconductor apparatus and method for fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12155530申请日: 2008-06-05
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公开(公告)号: US07829418B2公开(公告)日: 2010-11-09
- 发明人: Yasuhiko Ueda , Hiroyuki Fujimoto
- 申请人: Yasuhiko Ueda , Hiroyuki Fujimoto
- 申请人地址: JP Tokyo
- 专利权人: Elpida Memory, Inc.
- 当前专利权人: Elpida Memory, Inc.
- 当前专利权人地址: JP Tokyo
- 代理机构: McGinn IP Law Group, PLLC
- 优先权: JPP2007-151597 20070607
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A semiconductor apparatus including a trench gate transistor having at least an active region surrounded by a device isolation insulating film; a trench provided by bringing both ends thereof into contact with the device isolation insulating film in the active region; a gate electrode formed in the trench via a gate insulating film; and a diffusion layer formed close to the trench; on a semiconductor substrate, and also includes an opening portion positioned on one surface of the semiconductor substrate; a pair of first inner walls positioned in a side of the device isolation insulating film and connected with the opening portion; a pair of second inner walls positioned in a side of the active region and connected with the opening portion; and a bottom portion positioned opposite to the opening portion and connected with the first inner walls and the second inner walls, wherein a cross sectional outline of the second inner wall is substantially linear, and a burr generated inside the trench is removed or reduced.
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