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US07829992B2 Semiconductor device and method for manufacturing semiconductor device 有权
半导体装置及半导体装置的制造方法

Semiconductor device and method for manufacturing semiconductor device
摘要：
A semiconductor device (100) comprises a first resin substrate (101) on which a first semiconductor chip (125) is mounted a surface thereof; a second resin substrate (111) on which a second semiconductor chip (131) is mounted on a surface thereof; and a resin base material (109), joined to a front surface of the first resin substrate (101) and to a back surface of the second resin substrate (111), so that these surfaces are electrically connected. The resin base material (109) is disposed in a circumference of the first resin substrate (101) in the surface of the first resin substrate (101). Further, the first semiconductor chip (125) is disposed in a space section provided among the first resin substrate (101), the second resin substrate (111) and the resin base material (109) in the surface of the first resin substrate (101).
摘要（中）：

半导体器件（100）包括第一树脂基板（101），第一半导体芯片（125）的表面安装有第一树脂基板（101） 第二树脂基板（111），其表面上安装有第二半导体芯片（131）; 以及与第一树脂基板（101）的前表面和第二树脂基板（111）的背面接合的树脂基材（109），使得这些表面电连接。 树脂基材（109）在第一树脂基板（101）的表面设置在第一树脂基板（101）的周围。 此外，第一半导体芯片（125）设置在设置在第一树脂基板（101），第二树脂基板（111）和树脂基材（109）之间的空间部分中，第一树脂基板 ）。

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