Invention Grant
- Patent Title: Contact structure having a compliant bump and a test pad
- Patent Title (中): 接触结构具有柔性凸块和测试垫
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Application No.: US11762729Application Date: 2007-06-13
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Publication No.: US07834453B2Publication Date: 2010-11-16
- Inventor: Shyh-Ming Chang
- Applicant: Shyh-Ming Chang
- Applicant Address: TW Hsinchu TW Taoyuan TW Hsinchu TW Taipei County TW Tainan County TW Hsinchu TW Miao-Li County
- Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Displays Corp.
- Current Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Displays Corp.
- Current Assignee Address: TW Hsinchu TW Taoyuan TW Hsinchu TW Taipei County TW Tainan County TW Hsinchu TW Miao-Li County
- Agency: Jianq Chyun IP Office
- Priority: TW95127901A 20060728; TW95139501A 20061026; TW96101568A 20070116
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44
Abstract:
A contact structure including a contact pad, a polymer bump and a conductive layer is provided in the present invention. The contact pad is disposed on a substrate. The polymer bump is disposed on the contact pad. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad. The invention further discloses a manufacturing method of a contact structure. First, a substrate is provided having a contact pad already formed thereon. Then, a polymer bump is formed on the contact pad and a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.
Public/Granted literature
- US20080023832A1 CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-01-31
Information query
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