发明授权
US07834469B2 Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame
有权
包括堆叠在引线框架上的芯片封装和芯片的堆叠型芯片封装结构
- 专利标题： Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame
- 专利标题（中）： 包括堆叠在引线框架上的芯片封装和芯片的堆叠型芯片封装结构
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申请号： US12428277申请日： 2009-04-22
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公开(公告)号： US07834469B2公开(公告)日： 2010-11-16
- 发明人: Yao-Kai Chuang , Chien Liu , Chih-Ming Chung , Chao-Cheng Liu
- 申请人： Yao-Kai Chuang , Chien Liu , Chih-Ming Chung , Chao-Cheng Liu
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Cooley LLP
- 优先权： TW97117464A 20080512
- 主分类号： H01L23/29
- IPC分类号： H01L23/29
摘要：
A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip.
公开/授权文献
- US20090278242A1 STACKED TYPE CHIP PACKAGE STRUCTURE 公开/授权日：2009-11-12
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