发明授权
US07837804B2 Substrate cleaning method, substrate cleaning equipment, computer program, and program recording medium
有权
基板清洗方法，基板清洗设备，计算机程序和程序记录介质
- 专利标题： Substrate cleaning method, substrate cleaning equipment, computer program, and program recording medium
- 专利标题（中）： 基板清洗方法，基板清洗设备，计算机程序和程序记录介质
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申请号： US10594549申请日： 2005-04-19
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公开(公告)号： US07837804B2公开(公告)日： 2010-11-23
- 发明人: Hiroki Ohno , Kenji Sekiguchi
- 申请人： Hiroki Ohno , Kenji Sekiguchi
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Smith, Gambrell & Russell, LLP
- 优先权： JP2004-128764 20040423
- 国际申请： PCT/JP2005/007450 WO 20050419
- 国际公布： WO2005/104200 WO 20051103
- 主分类号： B08B7/04
- IPC分类号： B08B7/04
摘要：
In a dry process after a cleaning process using a cleaning-liquid nozzle and a rinse process using a side rinse nozzle are performed on a wafer W, the wafer W is turned, feeding of pure water to a center point of the wafer W from a pure-water nozzle is started, and substantially at the same, injection of a nitrogen gas from a gas nozzle to a center portion of the wafer W at a point at an adequate distance apart from the center of the wafer W is started. Next, while the pure-water nozzle is caused to scan toward the periphery of the wafer W, the gas nozzle is caused to scan toward the periphery of the wafer W in an area radially inward of the position of the pure-water nozzle after the gas nozzle passes the center of the wafer W.