Invention Grant
US07838336B2 Method and structure for dispensing chip underfill through an opening in the chip
有权
通过芯片开口分配芯片底部填充物的方法和结构
- Patent Title: Method and structure for dispensing chip underfill through an opening in the chip
- Patent Title (中): 通过芯片开口分配芯片底部填充物的方法和结构
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Application No.: US11860226Application Date: 2007-09-24
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Publication No.: US07838336B2Publication Date: 2010-11-23
- Inventor: Gerald K. Bartley , Darryl J. Becker , Paul E. Dahlen , Philip R. Germann , Andrew B. Maki , Mark O. Maxson
- Applicant: Gerald K. Bartley , Darryl J. Becker , Paul E. Dahlen , Philip R. Germann , Andrew B. Maki , Mark O. Maxson
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Dillon & Yudell LLP
- Main IPC: H01L21/98
- IPC: H01L21/98
Abstract:
A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed between the die and the carrier via the through hole.
Public/Granted literature
- US20090079060A1 METHOD AND STRUCTURE FOR DISPENSING CHIP UNDERFILL THROUGH AN OPENING IN THE CHIP Public/Granted day:2009-03-26
Information query
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