Invention Grant
- Patent Title: Dual mode ion source for ion implantation
- Patent Title (中): 用于离子注入的双模离子源
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Application No.: US11268005Application Date: 2005-11-07
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Publication No.: US07838842B2Publication Date: 2010-11-23
- Inventor: Thomas N. Horsky
- Applicant: Thomas N. Horsky
- Applicant Address: US MA North Billerica
- Assignee: Semequip, Inc.
- Current Assignee: Semequip, Inc.
- Current Assignee Address: US MA North Billerica
- Agency: Katten Muchin Rosenman LLP
- Agent John S. Paniaguas
- Main IPC: H01J27/00
- IPC: H01J27/00 ; H05B31/26

Abstract:
An ion source is disclosed for providing a range of ion beams consisting of either ionized clusters, such as B2Hx+, B5Hx+, B10Hx+, B18Hx+, P4+ or As4+, or monomer ions, such as Ge+, In+, Sb+, B+, As+, and P+, to enable cluster implants and monomers implants into silicon substrates for the purpose of manufacturing CMOS devices, and to do so with high productivity. The range of ion beams is generated by a universal ion source in accordance with the present invention which is configured to operate in two discrete modes: an electron impact mode, which efficiently produces ionized clusters, and an arc discharge mode, which efficiently produces monomer ions.
Public/Granted literature
- US20060097645A1 Dual mode ion source for ion implantation Public/Granted day:2006-05-11
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