Invention Grant
- Patent Title: Stacked card address assignment
- Patent Title (中): 堆叠卡地址分配
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Application No.: US11526459Application Date: 2006-09-25
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Publication No.: US07840732B2Publication Date: 2010-11-23
- Inventor: Dinesh Kumar Kn , Narasimha Murthy S
- Applicant: Dinesh Kumar Kn , Narasimha Murthy S
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F15/16 ; H04L12/28 ; H04L12/56 ; H01L23/02 ; H01R12/16

Abstract:
Stacking of electronics modules, boards or cards, hereinafter referred to as cards is described. Each card in a stack is connected logically to a host via a single physical bus slot, and can detect its relative position in the stack on initial power on and make use of that information to grab an appropriate resource pool. In one embodiment, a top most card is used as a reference and the rest of the cards in the stack derive a relative address with respect to the top most card. A few lines are dedicated between neighboring cards through which the cards can share their relative address information with succeeding cards and automate resource allocation based on the address information.
Public/Granted literature
- US20080077718A1 Stacked card address assignment Public/Granted day:2008-03-27
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