发明授权
- 专利标题： Socket with solder pad
- 专利标题（中）： 带焊盘的插座
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申请号： US12229012申请日： 2008-08-18
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公开(公告)号： US07841859B2公开(公告)日： 2010-11-30
- 发明人: Fang-Chu Liao , Chun-Yi Chang
- 申请人： Fang-Chu Liao , Chun-Yi Chang
- 申请人地址： TW Taipei Hsien
- 专利权人： Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人： Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人地址： TW Taipei Hsien
- 代理商 Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- 优先权： CN200720042961U 20070818
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
A socket, for electrically connecting an IC package and a printed circuit board, comprises an insulative housing and a plurality of contacts received in the insulative housing. The insulative housing has an opening in a center thereof, a solder pad is received in the opening and has a soldering board which is soldered to the printed circuit board to enhance a mechanical connection between the socket and the printed circuit board.
公开/授权文献
- US20090047805A1 Socket with solder pad 公开/授权日：2009-02-19
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