A soldering apparatus has a fixture receiving an electronic component and a conducting wire, with a free end of the conducting wire superimposed on the soldering area of the electronic component, a convey mechanism capable of transmitting the fixture downstream, a daubing device, and a soldering device. The daubing device has a level movable element capable of moving along a convey direction of the convey mechanism, and a vertical movable element mounted on the level movable element and capable of moving along an upward and downward direction. A carrier mounted to the vertical movable element has a solder paste can for loading the solder paste, and an output portion for dispensing the solder paste to the soldering area. The soldering device has a soldering head heating the solder paste for shrinking the insulator, with the core wire exposing and connected to the soldering area by the cool solder paste.