发明授权
- 专利标题： Method and apparatus for bonded substrates
- 专利标题（中）： 粘合基材的方法和装置
-
申请号： US12025514申请日： 2008-02-04
-
公开(公告)号： US07846813B2公开(公告)日： 2010-12-07
- 发明人: Yuri V. Sokolov , Donald Roy , Tyler Hook
- 申请人： Yuri V. Sokolov , Donald Roy , Tyler Hook
- 申请人地址： US ME South Portland
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US ME South Portland
- 代理机构： Townsend and Townsend and Crew LLP
- 主分类号： H01L21/30
- IPC分类号： H01L21/30
摘要：
A method for forming bonded substrates includes providing a plurality of substrates, each of which having a top surface. A characteristic length for each of the plurality of substrates is determined by: determining a topographical profile of the top surface of the substrate from an interior portion to an edge portion along a radial direction, determining a highest point of the profile, and defining the characteristic length as a distance from the highest point to the edge portion. A first substrate and a second substrate are selected where at least one of the first or the second substrates has a characteristic length shorter than a predetermined length. The first substrate and the second substrate are brought into contact and form bonded substrates, with the top surface of the first substrate facing the top surface of the second substrate.
公开/授权文献
- US20090197053A1 METHOD AND APPARATUS FOR BONDED SUBSTRATES 公开/授权日：2009-08-06
信息查询
IPC分类:
