发明授权
- 专利标题： Multi-layered platelet structure
- 专利标题（中）： 多层血小板结构
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申请号： US11656726申请日： 2007-01-23
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公开(公告)号： US07846853B2公开(公告)日： 2010-12-07
- 发明人: Gary Stevens , James D. B. Smith , John W. Wood , Peter Groeppel
- 申请人： Gary Stevens , James D. B. Smith , John W. Wood , Peter Groeppel
- 申请人地址： US FL Orlando
- 专利权人： Siemens Energy, Inc.
- 当前专利权人： Siemens Energy, Inc.
- 当前专利权人地址： US FL Orlando
- 主分类号： B32B5/16
- IPC分类号： B32B5/16 ; B32B27/04
摘要：
An electrical insulation paper that is made of mica flakelets (22), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (26), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (17), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.
公开/授权文献
- US20070141324A1 Multi-layered platelet structure 公开/授权日：2007-06-21
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