Invention Grant
- Patent Title: Ion implanting apparatus
- Patent Title (中): 离子注入装置
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Application No.: US12279653Application Date: 2007-02-15
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Publication No.: US07847271B2Publication Date: 2010-12-07
- Inventor: Seiji Ogata , Ryota Fukui , Hidekazu Yokoo , Tsutomu Nishihashi
- Applicant: Seiji Ogata , Ryota Fukui , Hidekazu Yokoo , Tsutomu Nishihashi
- Applicant Address: JP Chigasaki
- Assignee: Ulvac Inc.
- Current Assignee: Ulvac Inc.
- Current Assignee Address: JP Chigasaki
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-041408 20060217
- International Application: PCT/JP2007/052778 WO 20070215
- International Announcement: WO2007/094432 WO 20070823
- Main IPC: H01J37/317
- IPC: H01J37/317 ; H01J37/256

Abstract:
An ion implanter for manufacturing a single crystal film by extracting a hydrogen ion or a rare-gas ion from an ion source, selects a desired ion with a first sector electromagnet, scanning the ion with a scanner, collimates the ion with a second sector electromagnet, and implants it into a substrate; the ion source is configured to be located close to the entrance side focal point of the first sector electromagnet. In this case, when an aperture of an extraction section of the ion source is circular and entrance side focal points in a deflection surface and a surface perpendicular thereto in the first sector electromagnet are coincident, the ion beam after passing the first sector electromagnet becomes completely parallel in the two surfaces and the spot shape becomes a circle.
Public/Granted literature
- US20090072164A1 ION IMPLANTING APPARATUS Public/Granted day:2009-03-19
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