发明授权
- 专利标题： Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
- 专利标题（中）： 焊料合金材料层组成，导电和粘合剂组合物，焊剂材料层组成，焊球转印片，凸块和凸块形成工艺以及半导体器件
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申请号： US11216561申请日： 2005-08-31
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公开(公告)号： US07847406B2公开(公告)日： 2010-12-07
- 发明人: Hitoshi Arita , Akio Kojima
- 申请人： Hitoshi Arita , Akio Kojima
- 申请人地址： JP Tokyo
- 专利权人： Ricoh Company, Ltd.
- 当前专利权人： Ricoh Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Cooper & Dunham LLP
- 优先权： JP2002-322678 20021106; JP2002-340384 20021125; JP2002-342329 20021126
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet. The present invention provides a method for forming the bumps, which includes forming a solder alloy material layer and flux material layer one by one on an intermediate metallic layer formed on an external electrode pad in a semiconductor device, and then fusing these layers, wherein each of the solder alloy material layer and flux material layer is formed by a liquid spraying method (e.g., ink jetting method).
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