Invention Grant
- Patent Title: System and method for cooling electronic systems
- Patent Title (中): 冷却电子系统的系统和方法
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Application No.: US12022683Application Date: 2008-01-30
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Publication No.: US07848101B2Publication Date: 2010-12-07
- Inventor: Subhrajit Dey , Petrus Joannes Joseph Moeleker , Chellappa Balan
- Applicant: Subhrajit Dey , Petrus Joannes Joseph Moeleker , Chellappa Balan
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Cantor Colburn LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; A47F3/04
Abstract:
A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.
Public/Granted literature
- US20080117590A1 SYSTEM AND METHOD FOR COOLING ELECTRONIC SYSTEMS Public/Granted day:2008-05-22
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