发明授权
- 专利标题: Mold structure
- 专利标题(中): 模具结构
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申请号: US11946198申请日: 2007-11-28
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公开(公告)号: US07850441B2公开(公告)日: 2010-12-14
- 发明人: Toshihiro Usa , Kenji Ichikawa , Kazunori Komatsu
- 申请人: Toshihiro Usa , Kenji Ichikawa , Kazunori Komatsu
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM Corporation
- 当前专利权人: FUJIFILM Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2006-328796 20061205
- 主分类号: B29D17/00
- IPC分类号: B29D17/00
摘要:
There is provided a mold structure containing a substrate, and a plurality of convex portions formed in the shape of concentric circles at predetermined intervals on one surface of the substrate, wherein a cross-sectional shape of the convex portions with respect to a radial direction of the concentric circles is such that a middle width M of each of the convex portions with respect to a heightwise direction is greater than a width T of a top portion of each of the convex portions with respect to the radial direction of the concentric circles.
公开/授权文献
- US20080142680A1 MOLD STRUCTURE 公开/授权日:2008-06-19
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