利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US07854368B2 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers 有权
使用电介质间隔物共同分配的受控阻抗线接合的方法和结构

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
摘要：
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
摘要（中）：

制造电子互连的方法（和结构）包括用于要互连的信号线，使用被配置为提供受控阻抗效应的多个接合线。

公开/授权文献
信息查询
Espacenet
0/0