发明授权
- 专利标题： Ceramic packaging for high brightness LED devices
- 专利标题（中）： 陶瓷包装用于高亮度LED器件
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申请号： US10669986申请日： 2003-09-23
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公开(公告)号： US07854535B2公开(公告)日： 2010-12-21
- 发明人: Lee Kong Weng , Ng Kee Yean , Lee Meng Ee
- 申请人： Lee Kong Weng , Ng Kee Yean , Lee Meng Ee
- 申请人地址： SG Singapore
- 专利权人： Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- 当前专利权人： Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 主分类号： F21V7/00
- IPC分类号： F21V7/00
摘要：
Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.
公开/授权文献
- US20050063187A1 Ceramic packaging for high brightness LED devices 公开/授权日：2005-03-24
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