发明授权
- 专利标题： Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound
- 专利标题（中）： 半导体装置包括用模塑料覆盖半导体并在模塑料中形成通孔
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申请号： US11749293申请日： 2007-05-16
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公开(公告)号： US07863088B2公开(公告)日： 2011-01-04
- 发明人: Markus Brunnbauer , Jens Pohl , Rainer Steiner
- 申请人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.
公开/授权文献
- US20080284035A1 SEMICONDUCTOR DEVICE 公开/授权日：2008-11-20