Invention Grant
US07863147B2 Semiconductor device and fabrication method thereof 有权
半导体器件及其制造方法

Semiconductor device and fabrication method thereof
Abstract:
A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor substrate which comprise a first type well and a second type well, and a plurality of junction regions therebetween, wherein each of the junction regions adjoins the first and the second type wells. A gate electrode disposed on the semiconductor substrate and overlies at least two of the junction regions. A source and a drain are in the semiconductor substrate oppositely adjacent to the gate electrode.
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