摘要:
A lens film and a manufacturing method thereof are disclosed. The lens film manufacturing method includes the steps of: forming an alignment film on a glass substrate; rubbing the alignment film along a rubbing direction; dispersing a liquid crystal polymer (LCP) material between the alignment film of the glass substrate and a lens mold; rolling the lens mold along a rolling direction to make the LCP material to form a lens film. A plurality of liquid crystal molecules of the lens film is affected by the alignment film to align along the rubbing direction. The lens film and a base panel having a polarization direction are operated in a LCD apparatus. The angle between the rubbing direction and the polarization direction is less than 15°.
摘要:
A fin type heat sink includes a heat conducting base, fins, pressing plates and positioning members. The fins are parallely installed with an interval apart from each other on the heat conducting base, and a fixing plate is perpendicularly extended from the bottom of each fin. The fixing plate includes through holes, and the pressing plate is installed corresponding to the fin. Each pressing plate is installed on the fixing plate and has combining holes corresponding to the through holes, and the positioning member is fixed onto the heat conducting base, and the positioning member is passed through the through hole and the combining hole and fixed onto the pressing plate, such that the pressing plate presses the fixing plate flatly onto the heat conducting base. Therefore, heat at the heat conducting base can be conducted to the fins quickly to enhance the thermal conduction effect.
摘要:
An embodiment of the invention provides a chip package, which includes: a semiconductor substrate having a device region and a non-device region neighboring the device region; a package layer disposed on the semiconductor substrate; a spacing layer disposed between the semiconductor substrate and the package layer and surrounding the device region and the non-device region; a ring structure disposed between the semiconductor substrate and the package layer, and between the spacing layer and the device region, and surrounding a portion of the non-device region; and an auxiliary pattern including a hollow pattern formed in the spacing layer or the ring structure, a material pattern located between the spacing layer and the device region, or combinations thereof.
摘要:
A method for fabricating a semiconductor device is provided. A substrate comprising a P-well is provided. A low voltage device area and a high voltage device area are defined in the P-well. A photoresist layer is formed on the substrate. A photomask comprising a shielding region is provided. The shielding region is corresponded to the high voltage device area. A pattern of the photomask is transferred to the photoresist layer on the substrate by a photolithography process using the photomask. A P-type ion field is formed outside of the high-voltage device area by selectively doping P-type ions into the substrate using the photoresist layer as a mask.
摘要:
A display includes a backlight module having elongated lamps. At least a pair of the lamps has a first lamp and a second lamp that are electrically connected in series. The first lamp and the second lamp are spaced apart with at least a third lamp positioned between the first and second lamps.
摘要:
An administration and service system for wireless terminal display devices comprises a digital supplier supplying digital images, digital video or digital music; an administration server including a user identity administration system, an authentication and authorization system and a digital content administration system, wherein the administration server exchanges digital data with the digital supplier and transmits the digital data; and a terminal display device, which is a digital electronic product communicating with the administration server via a wireless network and performing data transmission and identity administration. The wireless network is based on a Wi-Fi technology, and the terminal display device may be a digital photo frame. The primary objective of the present invention is to enable a user to administrate contents and transmit the contents to a wireless terminal display.
摘要:
A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor substrate which comprise a first type well and a second type well, and a plurality of junction regions therebetween, wherein each of the junction regions adjoins the first and the second type wells. A gate electrode disposed on the semiconductor substrate and overlies at least two of the junction regions. A source and a drain are in the semiconductor substrate oppositely adjacent to the gate electrode.
摘要:
A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.
摘要:
The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n1 is 2-25, R1 is C1-10 alkyl or H and R2 is H or CH3; (c) adding a water-soluble polymer in the suspension; (d) adding a bi-functional acrylic oligomer of formula (II) in the suspension, wherein n2 is 3-50, and R3 and R4 independently are H or CH3; (e) after the step (d), drying the suspension to form a film; (f) exposing the film under UV light to cure the film; and (g) stretching the film, wherein the film has only a negative C-plate property before the stretching and has both negative C-plate and positive A-plate properties after the stretching.
摘要:
A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.